ASEE is hosting a two-part three-and-a-half-long each virtual workshop for the National Science Foundation (NSF) to publicize a newly established funding opportunity and to encourage research collaboration between U.S. and Taiwan researchers in semiconductor science and technology, through a pilot partnership program, Advanced Chip Engineering Design and Fabrication (ACED Fab). 

View the NSF Advanced Chip Engineering Design and Fabrication (ACED Fab) Program Solicitation here. 

This pilot partnership program is guided by the recently signed Memorandum of Understanding (MOU) on Research Cooperation by the U.S. National Science Foundation (NSF), through its Directorate for Engineering (ENG), and the Taiwan National Science and Technology Council (NSTC). NSF and NSTC intend to fund jointly ACED Fab research projects utilizing advanced technology nodes available at semiconductor foundries in Taiwan.

Part I (3.5 hours) of this workshop will be in webinar format to introduce the pilot program and to convene leaders in advanced semiconductor materials, devices, and systems to discuss challenges and emerging opportunities in semiconductor design and fabrication, as well as their integration and key applications. 

Part II (3.5 hours) of this workshop will be focused on accessing the advanced technologies and exploring potential collaborations. It will be in virtual symposium format including an information session (on utilizing technology services, conducting cloud-based designs, and Q&As for NSF-NSTC funding opportunities), a poster session and breakdown round table discussion sessions. Researchers interested in the funding opportunities are strongly encouraged to attend the Part II of the workshop and to submit Posters and/or Research Profiles.